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SiGen vFinal DR 2/9/09 11:15 Page 32
MANUFACTURINGISSUES
The SiGen
coolant. In either case, inherent kerf loss due to cell. The resultant reduction in material demand
the sawing process results in loss of polySi allows for a proportional reduction on the number
process
utilization of up to 50% of the incoming material. of pullers, blockers and cleaners required. The
This polySi loss represents a significant cost to the process eliminates slurry and wire contaminants
consists of
industry. The SiGen cleaving approach has been and the subsequent cost to minimise their impact
developed to produce wafers with near zero kerf on to the environment.
two major
loss, providing significant cost savings.
steps. The
Kerf free process
These savings are realised in a number of ways to The SiGen process consists of two major steps.
first is an
create near zero kerf loss resulting in immediate The first is an implant step to develop a sub
savings of initial material costs. The process allows surface cleave plane and then a cleave step to
implant step
for the manufacture of wafers at thicknesses from slice PV wafers of various thicknesses at the pre-
Issue IV 2009
20µm to 150µm, reducing material demand per determined cleave plane from mono crystalline
to develop
a sub
surface
-pv-management.com
cleave plane
.solar and then
www
a cleave
32 step to slice
PV wafers
of various
thicknesses
at the pre-
determined
cleave plane
Figure 2. Cleaving vs
Sawing Manufacturing
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