This page contains a Flash digital edition of a book.
Solar Awards Thin Film Innovation Award Final DR 2/9/09 15:38 Page 29
SOLAR AWARDS
very low stress. This reduces the glass measurement modules from a single
breakage/rupture. This means low recess location.
and thus lower material costs. An
additional advantage is the lamination on Solar Metrology also offers a 12-page
several openings. Thus the multi-opening XRF technology guide for CIGS and CdTe
lamination line is very space-saving PV thin-film composition and thickness
compared to conventional single-opening measurement, describing typical XRF tool
laminators. layout and sub-assemblies along with the
features and benefits of various methods
relevant to solar PV film control. The
guide is designed to inform the user on
the basic theory and operation of the
systems, and covers topics such as
generation and detection columns (tubes,
collimation, detectors, processing),
algorithmic tools, and user interfaces. It is
Solar Metrology
intended as a quick reference to thin films of advanced PVs as well as
determine the appropriate insertion points critical surface roughness.
SMX-ILH (In-Line x-ray Head) of XRF measurement equipment for
specific CIS, CIGS and CdTe PV With 6-angstrom step-height repeatability,
Solar Metrology, with its System SMX applications. the Dektak 150 profiler provides the
portfolio, provides a production-ready flexibility to perform precise step-height
suite of thin-film thickness and measurements for thin films down to less
29
composition measurement tools for than 100 angstroms, as well as thick-film
research and process development, in-
Veeco Instruments
measurements up to several hundred
www
process monitoring and post-process Dektak 150 Surface Profiler microns thick. The Low-Inertia Sensor 3
.solar
quality control. (LIS 3) head is claimed to deliver
The Dektak 150 Surface Profiler, is extremely accurate measurements with
-pv-management.com
System SMX-ILH is designed to perform designed to monitor thin films of unprecedented sensitivity. The 512-micron
in-line, post-process measurements. It advanced PVs as well as critical surface vertical range is claimed to be the best
accommodates both flexible substrates roughness, key for optimal absorption of standard Z performance in the industry,
(such as stainless steel and polyimide) photons. The standard Dektak 150 utilizes and a 1-millimeter option extends the
and rigid substrates (such as glass), and a 4 x 4-inch X-Y stage with manual theta. vertical range of these systems even
allows for control of films. An available further. Improved horizontal and vertical
thermal shield extends SMX-ILH resolution enables precise planarity scans
Issue IV 2009
operational range to approximately 300C. for measuring radius of curvature,
There are two primary ILH system flatness, and waviness, as well as
configurations available. In an Open characterizing thin-film stress on wafers.
Beam system, the x-ray measurement
head is inserted directly into your The Dektak 150 incorporates a cast-
production line at a fixed location. Closed aluminium frame and several vibration
Beam units provide single or dual axis (X- It can be configured with a 4-inch Y auto and noise reduction features to provide
Y) positioning of the x-ray head, enabling stage that enables 3D imaging, or the lowest possible noise floor for
readings to be obtained on stationary or equipped with a 6-inch X-Y auto stage measuring extremely thin films, according
moving substrates. that, in addition to 3D mapping, provides to the company. In addition, the Dektak
automation and programmability of over 150 is able to measure thin film stress
An available Z-axis head drive lets you 200 sample sites. With the scan-stitching with longer scan lengths up to 55
adjust on the fly for substrate height package, the system can perform even millimetres and a larger vertical range up
variations. Cross-process drive longer scans for stress measurements on to 1 millimetre. The thin film stress
configurations are ideal for measuring larger wafers. Other stage features measurement software automatically
gradients and profiles in film or include wafer alignment pins for ease of calculates compressive or tensile stress.
composition across your substrate. The use, three-point suspension for stress, Plus, the Dektak 150 offers 3D imaging
SMX system control station can be lateral calibration for 99.9% accuracy, and capabilities to map a user-defined surface
positioned adjacent to or remotely from a larger scan block for improved baseline area to perform in-depth analysis of
the process, and enables you to control stability, according to the company. There surface defects and area roughness with
multiple Ethernet-connected ILH x-ray is a growing need to be able to monitor Veeco’s ‘Vision’ 3D analysis software.
Page 1  |  Page 2  |  Page 3  |  Page 4  |  Page 5  |  Page 6  |  Page 7  |  Page 8  |  Page 9  |  Page 10  |  Page 11  |  Page 12  |  Page 13  |  Page 14  |  Page 15  |  Page 16  |  Page 17  |  Page 18  |  Page 19  |  Page 20  |  Page 21  |  Page 22  |  Page 23  |  Page 24  |  Page 25  |  Page 26  |  Page 27  |  Page 28  |  Page 29  |  Page 30  |  Page 31  |  Page 32  |  Page 33  |  Page 34  |  Page 35  |  Page 36  |  Page 37  |  Page 38  |  Page 39  |  Page 40  |  Page 41  |  Page 42  |  Page 43  |  Page 44
Produced with Yudu - www.yudu.com